Tietueen sitaatit
APA-viiteKhorramdel, B. (2018). Additive and digital fabrication of 3D interconnects in MEMS packaging using printing technologies. Tampereen teknillinen yliopisto = Tampere University of Technology.
Chicago-tyylinen lähdeviittausKhorramdel, Behnam. Additive and Digital Fabrication of 3D Interconnects in MEMS Packaging Using Printing Technologies. Tampere: Tampereen teknillinen yliopisto = Tampere University of Technology, 2018.
MLA-viiteKhorramdel, Behnam. Additive and Digital Fabrication of 3D Interconnects in MEMS Packaging Using Printing Technologies. Tampereen teknillinen yliopisto = Tampere University of Technology, 2018.
Harvard-tyylinen lähdeviittausKhorramdel, B. 2018. Additive and digital fabrication of 3D interconnects in MEMS packaging using printing technologies. Tampere: Tampereen teknillinen yliopisto = Tampere University of Technology.